According to AMD's updated CPU release schedule, the chip maker plans to put several Phenom II X4 900 series chips on the chopping block. The company has already stopped taking orders for the Phenom II X4 910 (2.6Ghz) and 945 (3.0GHz) and will stop shipments in the second quarter of 2010.
Starting in the first quarter of 2010, AMD will no longer take orders for its Phenom II X4 965 (3.4GHz) and 925 (2.8Ghz) processors, while orders for the Phenom II X4 955 (3.2GHz) are scheduled to end in the second quarter.
In addition to the above named parts, AMD will start phasing out its Phenom II X4 800, X3 700, and X2 500 series, and Athlon II X4 600 and X3 400 series sometime next year.
To replenish its CPU lineup, AMD plans to launch a 95W Phenom II X4 955 processor in Q2 2010, as well as its six-core desktop chip codenamed Thuban. The 2.8Ghz Thuban part will be built around a 45nm manufacturing process and come with 512KB of L2 cache and 6MB of L3 cache.
Citing anonymous sources "familiar with their plans," Reuters reports that Cisco and storage area networking company EMC will work together to bring a new line of products to market dubbed vBlock. The new line will consist of cloud computing gear, including networking equipment, computers, and storage devices.
Cisco and EMC both declined to comment, but according to the talkative sources, the two companies will assemble computer systems for customers, which will also include all the necessary software.
"It's a 'virtual block' of the data center. You can buy it from them as a service, then eventually transition it to your own data center," said one of the people familiar with the plan.
Should the rumor turn out to be true -- and there's reason to believe it is, given that this isn't the first time the two have been linked in plans to jointly develop could-based solutions -- it will turn the heat up on rivals IBM and Hewlett-Packard, both of which offer a wider selection of data center equipment.
Last month we posted a link to some early spy shots of the Radeon HD 5850 X2 & 5870 X2, but aside from the pictures, the post was a bit short on details. The card which still hasn’t been officially unveiled by AMD is still somewhat of a mystery, but the gang over at Alienbabeltech.com got a hold of some new photos and information that answers some, but not all of the questions we have about the new design.
Based on the reference card shown in the pictures, it appears as though this monster will require two power connections, one 8-pin and one 6-pin which are located just above the fan. Even if the power requirements of this beast don't shock you, the overall length of the card just may. Measuring in at a whopping 13.5 inches long, most enthusiasts without a full tower case will have a hard time fitting this into their machines. AMD responded quickly by stating that the photos were of an engineering sample, leading us to wonder if the card won’t shrink an inch or two prior to release.
The other big change since our last update is the new naming conventions. It now appears as though AMD will be dropping the “X2” designation and the cards will be known as the Radeon HD 5950 (Dual 5850’s), and the Radeon HD 5970 (Dual 5870’s).Questions remain, but hey, its better then nothing right?
Everyone and their CPU-cooler-manufacturing mother are jumping aboard the skyscraper-formfactor bandwagon, hoping to match the performance of Thermalright’s Ultra-120 eXtreme and Noctua’s NH-U12P air coolers. Last month we tested Zalman’s attempt, and this month we have Thermaltake’s answer, the ISGC-300, one of a series of four ISGC-branded air coolers recently released into the wild. Thermaltake’s creative relationship with the English language is responsible for the ISGC moniker, which stands for “Inspiration of Silent Gaming Cooling.”
The ISGC-300 consists of a copper heat exchanger with four heat pipes running into a tower of 33 saw-toothed fins. At 6.24 inches high by five inches wide by 2.8 inches deep, it’s slightly shorter and narrower than Thermalright’s Ultra-120, but about a quarter-inch deeper. A 12cm white Thermaltake hydrodynamic-bearing fan is held onto the front using metal clips in a manner reminiscent of the Noctua NH-U12P. The nine-bladed fan is quiet and includes a variable-speed switch in lieu of a four-pin PVM connector. At its quietest, it’s nearly silent; at its loudest, it’s still damned quiet.
Information on the new product suggest it to be a device for streaming video from your computer to a television--with the biggest hint being an unreleased “FlipShare TV” manual. The device comes with three parts: the remote, a box to attach to your TV, and a transmitter for your computer. Video on your computer can be accessed with the FlipShare software and streamed wirelessly from the transmitter to the TV box. (Doesn’t AppleTV already do this, and much more?)
Little else is know about FlipShare TV. Does it, for example, do anything more than stream Flip videos? And information on pricing or availability is not yet known. But the picture sure does look nice.
If you were bummed like most of us that Intel’s shiny new P55 chipset didn’t include USB 3.0 and SATA 6.0 support, Asus's new U3S6 should make you happy.
For a mere 30 smackers, the U3S6 card gives you two USB 3.0 ports and two SATA 6.0 ports in a PCI-E card. The card has three primary components: an NEC D720200F1 USB 3.0 controller, a Marvell 88SE9123 SATA 6.0 controller, and a PLX PEX8613. The PLX part is the same chip the company uses on its SATA6 boards to helps ameliorate a problem with the P55 chipset.
More photos, details and our analysis after the jump!
During the FPD show in Japan, LG laid out its future plans for OLED displays with a roadmap that extends into 2016. And according to Wom Kim, LG's sales and marketing VP, that's the year OLED panels will cost less than LCD displays, providing it can leap over a handful of technological hurdles.
"We will be able to use a lwo-temperature polycrystal silicon with the sixth-generation size glass substrate," Kim said. "However, for 40-inch and larger panels, we have to use the eight-generation size glass substrate.Therefore, we have to develop equipment that can deal with an SPC process at a temperature of more than 700C."
Despite the challenges facing low-cost OLED displays, Kim believes his company will be able to transition from 50 percent higher material costs and 30 percent lower yields compared to LCDs in 2012, to a 20-30 percent lower material cost and equivalent yield in 2016.
Up until then, don't look for too many deals when it comes to OLED.
"Forty-inch and larger OLED panels will be fairly expensive in 2012, but they will be available in the market," Kim added.
It's pretty common for hardware vendors to artificially gimp their budget or lower cost parts. Take AMD's tri-core chip, for example, which comes with a core disabled that isn't necessarily bad. And who still remembers Nvidia's vanilla 6800 graphics card that came with 4 software-unlockable pipelines to transform it into a 6800GT? As it turns out, Nvidia may have taken the same software-based approach to its Ion LE platform.
Nvida's Ion LE sports the same 1080p HD playback capabilities as its pricier sibling, but in order to cut costs, LE kicks DirectX 10 support to the curb. But as MyHPMini forum member runawayprisoner discovered, his may be entirely software-based, and a quick driver hack is all it takes to get the regular Ion drivers to install.
All runawayprisoner did was is add Ion LE's device driver ID to the Ion drivers, and once he did that, they installed like a charm, DirectX 10 support and all.
Whether or not that means full DX10 support remains to be seen, but according to runawayprisoner, if nothing else DX9 gaming stands to receive a sizeable boost in performance up to 50 percent.
Low power consumption is the name of the game in the server market, and Intel thinks it has a winning hand with its upcoming two-core 'Clarksdale' processor. The low-power slice of silicon comes rated at just 30W and is being aimed at "microservers," a new form factor Intel began pushing at IDF.
"We're looking to define a new form factor that allows companies to come up with a uni-processor [machine] that's reasonably capable and cost-effective and easy to deploy," said Jason Waxman, General Manager in Intel's Server Platforms Group. "We want this to become a new building block for the types of applications where you have lots of Web servers or a hosting type of environment or something where you need many images of a server."
Initially, Clarksdale will come clocked at 2.26GHz and take advantage of Intel's Nehalem microarchitecture. This will replace the chip maker's current reference system consisting of hardback-sized PCBs running a 1.86GHz, 45W quad-core Lynnfield chip.
Looking longer-term, Intel will attempt to reduce the power consumption footprint down to just 25W when idle, and no more than 75W under a heavy load.
Here at Maximum PC, we love the Nintendo DS and its two suave screens just as much as the next tech publication, but now, we think we’re finally coming down with a case of DSitus. Let’s have a look through the recently updated DS family photo album, shall we? There’s DS phat, DS Lite, DSi, and – now introducing – the DSi XL.
So, what makes next year’s model so special? Well, for one, there are bigger screens, and then, well… pretty much just the bigger screens. More specifically, the DSi XL sports two 4.2 inch displays – as opposed to the DSi’s formerly formidable 3.25 inch displays, and the DS Lite’s pint-sized 3 inchers.
The latest heir to Nintendo’s portable dynasty – which also includes a bigger stylus, if you’re into that sort of thing – is expanding into America during quarter one of 2010. So far, there’s been no word on price other than that it’s "expected to be higher than that of the Nintendo DSi."
So, are you interested in nabbing a DSi XL, or is your portable game system fund still tapped after 2009’s DSi-PSP Go double-whammy?