Samsung today announced the introduction of 30nm-class DDR3 DRAM modules for PC upgrades, and if you're to take the company at its word, these new modules are all that and a bag of fat free chips with all the flavor of regular chips. More specifically, Samsung promises that this new generation of memory is faster and more energy efficient, claims you'll be able to put the test when the parts ship through consumer and retail channels later this summer.

Like rules and windows on an abandoned house, records are meant to be broken, and that's exactly what the rebels from G.Skill did at the Computex trade show in Taiwan. With the aid of lots of LN2, renowned overclockers Shamino, Fredyama, and Young Pro shattered the Super Pi 32M record at the G.Skill booth with a score of 5 minutes and 33.172 seconds, the fastest ever on an Intel LGA 1155 platform. The overclockers used G.Skill's DDR3-2400MHz Pi memory, which still had some frequency headroom left over once the Super Pi record was set.

Samsung is off to a fast start with its 32GB memory modules using 30nm-class, 4Gb (gigabit) DDR3 DRAM chips and is the first in the industry to start producing these parts. These massive memory kits won't end up in home systems, few of which could actually support that amount of RAM in the first place, but in cloud computing environments and advanced server systems where there's no such thing has having too much memory.

Panasonic said it's getting ready to start volume production of its ReRAM in 2012, which sounds like a DRAM maker taking a mulligan at the assembly line. It's actually something far cooler than that. Short for Resistance Random Access Memory, Panasonic's next generation memory chips are non-volatile, meaning they can store information when a system is powered down. That's just one of the many advantages to ReRAM.