VIA Technologies is unleashing its legal beagles at Apple for allegedly infringing on three microprocessor-related patents and has filed a complaint with the United States International Trade Commission (ITC) and the U.S. District Court of Delaware. The patent infringement allegations extend to Apple's iPhone, iPad, iPod, and Apple TV devices, as well as associated software.
You have third-party chip makers to thank for your USB 3.0 ports, a handful of which stepped up to the plate while AMD and Intel work on baking SuperSpeed USB 3.0 support into their chipsets. VIA Labs is one of those companies, and its 4-port VL800 and 2-port VL801 SuperSpeed USB Host controllers are now officially certified by the USB Implementators Forum (USB-IF), the non-profit organization whose mission is to maintain the USB spec and run a compliance program.
Without giving anything away, we can say you won't find VIA's EPIA-M900 mini-ITX motherboard in this year's Dream Machine. Where it will end up is in small form factor (SFF) embedded devices like ATMs and home automation systems, to give just two examples. The main draw here, and one VIA is highly touting, is that the EPIA-M900 is the world's first motherboard to sport a 64-bit Nano X2 E-Series dual-core processor (clocked at 1.6GHz).
VIA earlier this week said its VL701 low power USB 3.0 to SATA bridge controller has been certified by the USB Implementers Forum (USB-IF). This makes VIA the first and only company to achieve USB-IF bus-powered certification using a traditional hard drive, which draws more power than flash-based drives. VIA's SATA bridge will allow users to connect any SATA hard drive, SSD, or optical drive to their PC using a USB 3.0 port.
Hey, look who's finally joining the quad-core party! It's VIA, who according to reports, is announcing a new chip aptly called "QuadCore." The new part is comprised of two Nano X2 chips slapped onto a single package for a low-cost, low-power processor that will debut sometime in late 2011.
VIA showed off its Eden X2 dual-core processor today at the Embedded World 2011 exhibition. It's a x86 chip optimized for fanless implementations in embedded applications, both industrial and commercial. Despite the lack of active cooling, VIA backs the new chip with a 7-year longevity guarantee. Specs after the break.
We still have a ways to go until AMD and Intel implement native USB 3.0 support on their motherboards, but in the meantime, third-party chip makers have picked up the slack. NEC is one of them, and so is VIA, the latter of which has begun sampling new USB 3.0 controllers for external hard drives, DigiTimes reports.
VIA says its just-announced Nano X2 dual-core chip brings advanced multi-core performance to energy efficient PCs without raising heat output.
"The VIA Nano X2 processor arrives at a time when software architectures are now optimized for multi-thread computing," commented Richard Brown, VP International Marketing, VIA Technologies. "Improvements in semi-conductor fabrication means we can now double the number of processor cores while maintaining the same low energy consumption levels that our customers are used to."
The new chip is built on a 40nm manufacturing process and is one reason why VIA says it was able to keep power consumption down. It's based on the advanced 64-bit superscaler "Isaiah" architecture of previous single-core VIA Nano processors and features SSE4, native 64-bit support, full processor virtualization support, pin-to-pin compatibility with other other VIA processors, and a few other odds and ends.
The braggarts over at VIA are all too happy to announce that their company's VL750 USB 3.0 to NAND Flash Controller is the first in the world to receive certification from the USB Implementers Forum (USB-IF).
"SuperSpeed certification is an industry first that places us well ahead of the USB 3.0 pack," said Gibson Chen, Vice President of Sales at VIA Labs, Inc. "This quality certification combined with the market's broadest USB 3.0 product range, spanning host, hub, and device controllers, will assure our customers that we truly have the know-how to drive SuperSpeed in the mainstream."
Bless their hearts for thinking so, but until Intel equips its boards with native USB 3.0 support, any talk of USB 3.0 going mainstream is wishful thinking.
Regardless, VIA's VL750 chip features a 4-channel memory controller with interleaving support, and of course is backwards compatible with USB 2.0.