How many times have you wanted to curse a USB connector after it's taken you three attempts to plug it in correctly? You know what we're talking about -- there's the first attempt, which seemingly doesn't fit, so you switch it around and try again. Do'h, that's the wrong way! You then turn the connector back to the original orientation you tried, only this time -- the third time -- it works. Go figure. Thankfully, there's a solution in sight, and we have pics of what the USB Type-C connector will look like.
Kudos and high-fives go out to the USB 3.0 Promoter Group today for announcing the completion of the USB 3.1 specification, which adds enhancements to enable SuperSpeed USB to operate at up 10 Gbps. The added throughput compared to regular USB 3.0 is made possible via more efficient data encoding, allowing the USB 3.1 spec to reach speeds twice as high over enhanced, fully backward compatible USB connectors and cables.
You can argue the Earth is flat or that man never really landed on the moon, but if you really want to avoid looking foolish, then don't tell anyone Intel is deliberately stalling USB 3.0 long enough for LightPeak to drive a stake in the competing transfer interface. Actually, Intel has long held that the two aren't really competitors at all, and putting its money where its mouth is, Intel went out and received SuperSpeed USB 3.0 certification for its upcoming 7 Series and C216 chipset families.
You have third-party chip makers to thank for your USB 3.0 ports, a handful of which stepped up to the plate while AMD and Intel work on baking SuperSpeed USB 3.0 support into their chipsets. VIA Labs is one of those companies, and its 4-port VL800 and 2-port VL801 SuperSpeed USB Host controllers are now officially certified by the USB Implementators Forum (USB-IF), the non-profit organization whose mission is to maintain the USB spec and run a compliance program.
The braggarts over at VIA are all too happy to announce that their company's VL750 USB 3.0 to NAND Flash Controller is the first in the world to receive certification from the USB Implementers Forum (USB-IF).
"SuperSpeed certification is an industry first that places us well ahead of the USB 3.0 pack," said Gibson Chen, Vice President of Sales at VIA Labs, Inc. "This quality certification combined with the market's broadest USB 3.0 product range, spanning host, hub, and device controllers, will assure our customers that we truly have the know-how to drive SuperSpeed in the mainstream."
Bless their hearts for thinking so, but until Intel equips its boards with native USB 3.0 support, any talk of USB 3.0 going mainstream is wishful thinking.
Regardless, VIA's VL750 chip features a 4-channel memory controller with interleaving support, and of course is backwards compatible with USB 2.0.