Industry's first 3D TSV-based DDR4 modules go into mass production
The desktop isn't the only place you'll find interesting things happening with double data rate-4 (DDR4) memory. Samsung this week said it has begun mass producing what it claims is the industry's first 64GB DDR4 RDIMMs using three dimensional "through silicon via" (TSV) package technology intended for enterprise servers, cloud-based applications, and other data center solutions.
Go big or go home, right? Well if that's the case, tell Samsung's going to be late for dinner, because the memory chip maker isn't going home anytime soon. Samsung decided to instead go big by announcing the development of 32GB DDR3 registered dual inline memory modules (RDIMMs) built using 3D TSV (through silicon via) package technology.