Applying thermal paste to a CPU before dropping a heat sink on it isn't too much of a pain in the butt, but you have to do it carefully; as pretty much everybody reading this site probably knows, air bubbles and uneven application can affect cooling performance. What if you didn't have to worry about applying thermal paste? Crazy talk, I know, but during last week's Techno-Frontier convention in Tokyo, Sony Chemical & Information Device Corp was showing off a thermal sheet that it said has the same thermal conductivity of traditional paste.
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