Posted 09/18/09 at 06:52:54 PM by Pulkit Chandna

There is a general feeling that the world is inching toward the next big leap in display technology: 3D displays. According to an estimate, the market for 3D displays is expected to be worth $15.8 billion by 2015, a figure that can only be achieved with a compound annual growth rate of 95%. This leap in display technology will straddle a wide gamut of devices and form factors.

Now, according to Taiwanese trade publication Commercial Times, HP and Dell have placed orders for 3D notebooks with original design manufacturer (ODM) Wistron. The same ODM is also said to be in talks with Sony and Lenovo. The report went on to add that Wistron’s patented 3D technology ensures that the cost of its 3D notebooks doesn’t exceed that of ordinary notebooks by much.

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Posted 07/03/09 at 09:12:10 AM by Pulkit Chandna

Doug Freedman, an analyst for Broadpoint AmTech, has revealed to Cnet that early production units of ultra-thin laptops, which are being made out of plastic, are fissuring due to design flaws. He gleaned this information from his discussions with original equipment manufacturers (OEMs) and original design manufacturers (ODMs).

Freedman believes manufacturers will have to ultimately “go with a metal case” to achieve that ultra-thin form factor they are after. However, the use of metal cases will make ultra-thin notebooks costlier.

A reference to Intel’s CULV (Consumer Ultra Low Voltage) technology – meant for ultra-thin notebooks - in Freedman’s report elucidating the design issues prompted Intel to clarify that the “case design issues reported to be found by an ODM, not consumers, in early production units for ultra-thin laptops have nothing to do with Intel processors whatsoever.”

Freedman had said that some manufacturers are more interested in manufacturing 11-inch and 12-inch netbooks with the Atom processor rather than ultra-thin notebooks with Intel’s CULV technology.

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Posted 06/23/09 at 08:30:20 AM by Paul Lilly

In an effort to help save R&D costs for its own-brand motherboards, Intel will release ODM (Original Design Manufacturer) orders to Taiwan-based motherboard makers, with the first orders belonging exclusively to Foxconn, DigiTimes reports.

As it currently stands, Intel ships between 4-5 million units annually, but although the chip maker is reportedly looking to cut back, the company did say it will continue to design and develop motherboards, as well as closely cooperate with industry players in the motherboard market.

If it turns out to be true, the big loser in the new deal is Pegatron Technology, an Intel OEM partner which will stand on the sidelines for these new orders. Adding salt to the wound, Asus, Pegatron's biggest client, is looking to increase its outsourcing to other companies as well.

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