Back in February of this year, Samsung developed and validated its first 40nm DRAM chip, and now five months later, the chip maker announced it has begun mass producing 2Gb DDR3 using the smaller manufacturing process.
Samsung says the move to 40nm will provide around a 60 percent increase in production capacity over a 50nm process, and it won't all be relegated to the server market, according to news and rumor site DigiTimes. In addition to 16GB, 8GB, and 4GB RDIMMs for servers, Samsung will use the 40nm manufacturing process to build UDIMMs (unregistered in-line memory modules) for workstatios, desktops, and notebooks of up to 4GB.
The energy efficient chips support a data rate of up to 1.6Gbps at just 1.35V, double that of an 800Mbps 1Gb-based dual-die package.
Another DRAM patent lawsuit has been filed, and not by Rambus. Instead, a Canadian company alleges IBM has breached a number of DRAM-related patents, which include 6,608,703, 7,038,937, 6,680,654, 6,69,448, and 7,486,580.
Each patent relates to elements of DRAM technology, and according to Mosaid, the company which filed the lawsuit, IBM breached every single one by making and selling DRAM mircroprocessor and ASIC products which allegedly use the inventions.
To date, Mosaid's portfolio contains more than 850 patents and a long list of licensees for its DRAM and embedded memory patents. Some of these licensees include Fujitsu, NEC, Toshiba, Hitachi, Mitsubishi, Oki, Panasonic, Winbond, Sony, Samsung, Hynix, TSMC, Infineon, ProMOS, Powerchip, and Micron.
Mosaid said it filed the lawsuit when talks with IBM broke down.
Good news for storage buffs - Micron today said it has begun mass producing 34nm flash memory products, resulting in 16Gb (gigabit) and 32Gb NAND chips that will push high end storage capacities to new levels.
"Our industry-leading NAND products are opening new possibilities for some of the world's most popular consumer electronic devices," said Brian Shirley, vice president of Micron's memory group. "With our new 16- and 32Gb NAND chips in mass production, we are enabling customers to design cost-effective, high-capacity storage in their small-form factor products, using less space and fewer die."
Micron says its 32Gb MLC NAND chip is 17 percent smaller than its first -generation 32Gb chip, and that both new chips offer transfer speeds of up to 200MB/s.
As a result of the new product, mainstream SDHC cards may double in capacity from 4-8GB to 8-16GB, with 64GB or more leading the high-end market.
Patriot Memory has buddied up with AMD to release its first co-branded Gamer Series memory kit, the AMD Black Edition Ready DDR3 G Series.
"Platforms featuring the latest socket AM3 for AMD processors, including the AMD Phenom II processor family, takes full advantage of the new Patriot Gamer Series memory," said Leslie Sobon, VP of Product Marketing, AMD. "Combined with AMD OverDrive software version 3.0.2, users can experience a state-of-the-art, real time over-clocking utility that allows unprecedented control over their AMD processor / chipset and memory to help push the performance threshold to it peak limits."
Marketing jargon aside, the kits come in both DDR3-1600 and DDR3-1333 frequencies in Low Latency (9-9-9-24) and Enhanced Latency (7-7-7-20) form. Voltage requirements vary by kit, ranging from 1.5V (DDR3-1333 Low Latency) to 1.9V (DDR3-1600 Enhanced Low Latency).
Much to the chagrin of memory makers (and delight of consumers), DRAM contract prices have remained static in the second half of June, but that's getting ready to change. Memory makers expect supply to tighten up in July as more orders continue to come in following stronger demand from PC makers.
Looking longer term, industry sources indicate contract prices for DRAM chips have started showing signs of a rebound and should continue to improve for the rest of the year. Furthermore, the price gap between branded finished memory chips and eTT (effective tested) chips is expected to widen significantly in the second half of 2009, DigiTimes reports.
If you've been putting off that memory upgrade, now might be a good time to pull the trigger.
DRAM contract prices have refused to budge during the second half of June, according to DRAMeXchange. The first half had witnessed an increase in contract prices and chip suppliers, encouraged by the token recovery, were planning to increase prices.
Although analysts expected DDR3 contract prices to rise on the back of increased demand resulting from the launch of ultra-thin notebooks, DDR3 prices have remained stagnant. DDR2 contract prices have remained static just as anticipated.
The contact prices for 2GB DDR3 and 2GB DDR2 chips have averaged $23 and $21.50, respectively, in the second half of June. On the other hand, the contract prices for 1GB DDR3 and 1GB DDR2 chips are $1.25 and $1.16, respectively.
Zotac, a relative newcomer to the videocard market, has doubled up the amount of GDDR3 memory found on most GTX 275 videocards to 1792MB. Sparkle and EVGA are the only other two GPU partners to pack the same amount of memory on the GTX 275.
"We try to deliver the best performance value for gamers. With the new Zotac GeForce GTX 275 1792MB, we've managed to achieve a balance of performance and value for those that demand more video memory for gaming at extreme HD resolutions," said Carsten Berger, marketing director, Zotac International.
Additional memory aside, Zotac's GTX 275 follows closely Nvidia's reference specification, with core, shader, and memory clockspeeds checking in at a 633MHz, 1404MHz, and 2268MHz, respectively, 240 stream processors, and a 448-bit memory interface.
More and more memory kits are starting to ship with high-profile heatspreaders, and the latest modules to receive Kingston's T1 makeover is the tri-channel HyperX 1600MHz 6GB kit.
"The 1600MHz frequency is a sweet spot amongst gamers, and combining it with the popular T1 heatspreaders gives enthusiasts a performance advantage through improved heat diffusion while overclocking and gaming," Kingston wrote in a press release.
Kingston says its revised 6GB kit -- part number KHX12800D3T1K3/6GX -- is available now for $155 MSRP. Other HyperX kits sporting "heavy-duty" aluminum T1 heatspreaders include the triple-channel DDR3-2000MHz and DDR3-1866MHz kits, and dual-channel DDR2-1066MHz and DDR2-800MHz kits.
We're just now starting to get used to seeing 6GB and 12GB of total memory in desktop systems, but such capacities are suddenly quaint compared to the latest 32GB modules Samsung's cooked up, even if not headed for the desktop.
According to Samsung, it's the world's first 32GB DDR3 RAM stick, and it was built using a 50nm process. A total of 72Gb (gigabit) DDR3 chip dies arranged in a row of nine quad-die packaged 16Gb DDR3s are packed on each side of the module, resulting in 32GB of total memory. And in addition to boasting higher capacity, Samsung says its 32GB RDIMM also improves throughput by 20 percent and consumes less power at 1.35V compared to previous sticks running 1.5V.
No word yet on price or availability, or when Samsung plans to launch its 8GB modules designed for the desktop.
Worried your RAM might go up flames from the extra voltage you're pumping through? You can worry a little less with OCZ's XTC (Xtreme Thermal Convection) Memory Cooler Revision 2, the latest in a limited field of active RAM coolers.
"The first revision of the OCZ XTC Memory Cooler proved to be a very popular product with a wide range of enthusiast and power users," said Ryan Edwards, Director of Product Management for OCZ. "We are excited to offer a follow-up design with improved performance, an enhanced feature set, and a sleek new look, all at the same affordable price point as the original."
Made of brushed aluminum, OCZ's newest XTC cooler installs over the top of your RAM modules by snapping into your motherboard's DIMM socket retention levels. Two 60mm fans provide airflow for your memory, and according to OCZ, a new, taller profile means you can use the second revision XTC cooler with memory kits sporting taller heatsinks. Fan speed is adjustable (low or high), and of course tricked out with blue LEDs.