Amended agreement includes $50 million in additional purchase commitments
AMD bumped up its purchase commitments with GlobalFoundries in 2014 by about $50 million. Under terms of the amended Wafer Supply Agreement (WSA), AMD expects to pay $1.2 billion in all this year, though what's interesting is that the deal is no longer limited to traditional CPUs and APUs; it now includes GPUs and semi-custom game console chips, such as those found in the Xbox 360 and PlayStation 4.
TSMC's 2012 chip sales were nearly four times higher than that of Globalfoundries.
Remember M.C. Hammer? Someone press play on "Can't Touch This," which should be the theme song for Taiwan Semiconductor Manufacturing Company (TSMC), the top contract chip supplier in 2012. Barring something extraordinary, TSMC will probably lead 2013 sales too, considering its nearest competitor, Globalfoundries, raked in almost four times less cash last year.
AMD will spend two-thirds less on wafers from Globalfoundries under terms of a renegotiated deal.
Everyone seems to be tightening their belts these days, including Advanced Micro Devices (AMD). Strapped for cash and in the midst of an ambitious restructuring effort, the Sunnyvale chip designer amended its Wafer Supply Agreement (WSA) with Globalfoundries. Under terms of the revised deal, AMD is only on the hook to purchase a third of the wafers it previously agreed to, though it comes at the cost of a hefty fine.
It's taken Intel just three years to shrink its system-on-chip (SoC) process node from 32nm to 14nm (with a pitstop at 22nm along the way), and by 2014, it will be shipping 14nm chips in volume. Can anyone compete? Globalfoundries intends to give it an honest effort by aggressively accelerating its roadmap with a 14nm process of its own. The company's competing 14nm-XM (eXtreme Mobility) process will leverage 3D FinFET transistor technology for higher performance and better power efficiency in mobile devices.
Globalfoundries and ARM have inked a multi-year agreement to jointly develop optimized system-on-chip (SoC) solutions using 20-nanometer and FinFET process technologies, the two company's announced today. The new agreement is really an extension of a long-standing collaboration between these two firms, and it also includes work on graphics processors, which are becoming ever more important in the mobile space.
One thing you can't say about Globalfoundries is that it's afraid to spend money. After being spun-off from Advanced Micro Devices (AMD) in 2009, the contract chip maker went on to spend $8 billion through 2011 and now plans to spend an additional $3 billion on fabs and related equipment, with most of the funds going towards finishing a plant in New York and filling it with equipment.
When AMD spun off its manufacturing arm as GlobalFoundries back in 2009, it was assumed their controlling interest would drive the bulk of its investments in the same direction. AMD has been forced to use TSMC, a rival to GlobalFoundries in recent years to keep pace in the graphics card wars, however new rumors are suggesting Bulldozer might be forced to shift over as well.
A super group of five tech giants led by Intel and IBM will invest $4.4 billion over the next five years developing the next generation of computer chip technology in New York. This joint investment is expected to create nearly 7,000 jobs and retain thousands more, New York Governor Andrew M. Cuomo announced. The rest of the fab five include Globalfoundries, Taiwan Semiconductor Manufacturing Company (TSMC), and Samsung.
Bulldozer's staggered release is starting to make sense. AMD began revenue shipments of its first Bulldozer chips earlier in the month, but those were server-based "Interlagos" parts and not the desktop "Zambezi" variant that's seen a number of delays. Chalk it up to problems on the assembly line related to the 32nm manufacturing process.
GlobalFoundries and Samsung this week announced plans to extend their collaboration agreement and synchronize global semiconductor fabrication facilities to build high performance, low leakage 28nm chips based on High-K Metal Gate (HKMG) technology. The technology takes aim at mobile applications and, according to Samsung, begins to blur the line between mobile and desktop silicon.