Habey USA's new BIS-6630 compact fanless embedded PC isn't quite small enough to inconspicuously jam into your pants pocket, though at just 7.5 inches (W) x 7.5 inches (L) x 2.5 inches (H), it's just the right size for digital signage applications, which is what it's intended for. It's built around Intel's Cedar Trail platform and has a power efficiency rating of just 12W.
VIA just rolled out what the company claims is the industry's first ever dual-core Pico-ITX motherboard. The VIA EPIA-P900 packs a dual-core VIA Eden X2 1GHz x86 processor and VIA VX900H Media System Processor into the smallest commercialized form factor there is. The result is a pint-sized system that's capable of advanced multitasking and multimedia chores, including "flawless" Full HD video rendering.
Back in early 2009, we ran a piece in the QuickStart section of Maximum PC magazine on what effect the recession was having on the tech sector and what it might mean for company roadmaps. For that piece, an Intel spokesperson told us during a phone interview the chip giant has been through tough economic times before and the company understands "you can't save your way out of a recession; you spend your way out." It's over two years later now, times are still tough, and Intel is still spending money.
Stealth Computer played the part of witch doctor and shrunk the PC as you know it, that is unless you're used to holding full-fledged dual-core PCs in the palm of the your hand. That about sums up Stealth's new LPC-125LPM, a rugged small form PC that that can handle extreme temperatures and boasts energy efficiency by drawing less than 20W in operational power.
Cambridge chip designer ARM Holdings posted results for its second quarter and half year ended June 30, 2011. Revenue for the quarter jumped 27 percent to $190.2 million, up from $150.3 million one year prior. Total revenue for the year did slightly better, jumping 28 percent from $293.6 million one year ago to $375.7 million in the first half of 2011. Those numbers are somewhat modest by chip giant standards, but it's worth noting ARM added 29 processor licenses in the second quarter alone.
AMD today rolled out its G-Series platform, the world's first combination of low-power CPU and advanced GPU integrated into a single embedded Accelerated Processing Unit (APU). The G-Series is all about power, or more specifically, the power you're not consuming. According to AMD, these APUs carry thermal design power (TDP) ratings of 5.5 and 6.4 watts, resulting in up to 39 percent power savings compared to previous versions.
VIA showed off its Eden X2 dual-core processor today at the Embedded World 2011 exhibition. It's a x86 chip optimized for fanless implementations in embedded applications, both industrial and commercial. Despite the lack of active cooling, VIA backs the new chip with a 7-year longevity guarantee. Specs after the break.
An APU, in case you're not up to snuff on your tech acronyms, is an Accelerated Processing Unit, and today AMD announced the immediate availability of its new Embedded G-Series APU.
According to AMD, this is the world's first and only APU for embedded systems. It's based on AMD's Fusion technology, incorporating the chip maker's new lower-power x86 CPU based on the "Bobcat" core.
"AMD’s commitment is to ensure the game-changing technologies we develop for consumers and the enterprise are also available for the vast and growing embedded market,” said Patrick Patla, corporate vice president and general manager, Server and Embedded Division, AMD. “Today, we have a record number of embedded launch partners. They are using the unique advancements of the AMD Embedded G-Series APU to develop a brand new generation of highly differentiated, energy-efficient, small form-factor embedded systems that can deliver the vivid visual experience expected in our always-connected world."
The Embedded G-Series APU can be configured with up to 2 x86 Bobcat CPU cores with 1MB of L2 cache and clocked at up to 1.6GHz. Other features includes 9W or 18W TDP (depending on the number of cores), DirectX 11 graphics, third generation Unified Video Decoder (UVD), and support for DDR3-800/1066 memory.
Hazy mobile plans notwithstanding, the chip maker has signed up for the MeeGO mobile operating system project. It will be lending its engineering expertise to the open source Linux-based OS project, which already includes the likes of Intel, Nokia and the Linux Foundation as its backers.
“MeeGo represents an exciting, open-source mobile operating system we expect to be adopted by mobile and embedded device makers over time,” said Ben Bar-Haim, corporate vice president, software development, AMD. “We are glad to provide engineering resources to joint industry efforts like MeeGo and expect that this operating system will help drive our embedded plans and create expanded market opportunities for our forthcoming Accelerated Processing Units.”
You know that 32GB iPhone 4 you just pre-ordered? The amount of internal storage is going to seem comparatively quaint if Toshiba follows through with its plan to mass produce 128GB embedded NAND flash memory modules by the end of this year.
That's right folks, 128 awesome gigabytes of storage capacity could become standard on everything from high-end smartphones to tablet PCs, digital cameras, and everywhere else you find embedded flash chips. It's the highest capacity yet achieved in the industry, part of which is the result of Toshiba's 32nm manufacturing technology. The other part of the equation involves stuffing sixteen 64Gbit (equal to 8GB) NAND chips onto a dedicated controller into a package measuring just 17 x 22 x 1.4mm.
The implications here are huge, especially with competition ramping up in the mobile market. With 1GHz Snapdragon chips strutting through the smartphone scene and 2GHz chips on the horizon, smartphones are finally powerful enough to truly be considered handheld PCs. And with a spate of Android, WebOS, and Windows 7 tablets on the horizon, Apple's flagship 64GB iPad could suddenly become far less appealing, and for reasons other than lack of Flash support.