Patriot Memory today announced new densities, speeds, and triple-channel kits added to its Viper Xtreme series. The new "Sector 7" tri-channel kits, as they're being called, come in both 12GB and 6GB capacities with speeds of 2000MHz and 1600MHz. Meanwhile, the new "Sector 5" dual-channel kits sport 8GB and 4GB capacities rated at 1600MHz.
"Today we introduce new speeds and capacities to our flagship heatshield design," says Les Henry, Patriot’s VP of Engineering. "Now enthusiasts using either the Intel P55 or X58 platforms have a variety of options in terms of capacity and speeds with our new high performance heatshield design. Our Viper Xtreme Series showcases our expertise in developing and delivering performance solutions for the enthusiast market."
Patriot is pretty jazzed about its "custom designed heatshield with a hefty copper insert" weighing 6 grams. According to Patriot, this design works better than traditional aluminum heatsinks.
If you're going for a biohazard theme, we can't think of a memory kit better suited than Mushkin's new Radioactive Series with yellow heatspreaders and matching logo.
"We're elated to offer viscerally engaging products for our friends in the gaming and high performance sectors. We have many plans to cater to enthusiasts, and this kit release is just the tip of the iceberg," said Wade Shiflett, Marketing Director, Mushkin.
ASUSTek's entry-level Eee PC netbooks are due for a slight upgrade, according to reports that point to changes on the Asus support site, which now displays some new models currently not on the market. Apparently, the names of the new SKUs are nothing but existing netbook appellations suffixed by the letter D, which identifies models that feature DDR3-ready Intel Atom N455 single-core processors (1.66 GHz). Following the upgrade, the Eee PC 1001PQ, Eee PC 1001PX, and Eee PX 1005PX will be known as the Eee PC 1001PQD, 1001PXD, and 1005PXD, respectively. Pricing and shipping details are still awaited as there has been no official word on the upgrades.
Elpida, Japan's biggest player in the DRAM market, announced today it has developed a 30nm class 2Gb DDR3 SDRAM for PCs and consumer electronics. According to Elpida, it's the industry's smallest 2Gb DDR3 around.
The smaller chip size allows Elpida to achieve a 45 percent higher chip yield per wafer compared to its 40nm products, the company claims. In addition, Elpida says the shrink will help contain rising chip costs associated with process migration. And as for JEDEC specs, everything is kosher.
"Elpida's new chip meets the JEDEC specs for the high-speed DDR3-1855 and 1.35V low-voltage, high-speed DDR3L-1600 memory chips, both expected to become mainstream industry products in 2011," Elpida said. "Also, the 30nm DDR3 SDRAM is eco-friendly. As a DDR3 SDRAM it achieves one of the industry's lowest levels of electric current usage (approximately 15 percent less operating and approximately 10 percent less standby usage compared with Elpida's 40nm products)."
Elpida said it will begin sample shipments in December 2010, with volume shipments slated for the same month.
In the midst of bombarding the market with a bazillion solid state drive models, OCZ has gone back to its roots and introduced a handful of desktop memory kits.
Taking aim at gamers with a green eye, the new kits consist of Ultra-Low Voltage (ULV) and Extreme-Low Voltage (ELV) grade DDR3 that OCZ promises has the chops to fit in with an enthusiast oriented build.
"We are pleased to announce a complete range of low-voltage memory offerings designed for the latest crop of energy efficient platforms," said Eugene Chang, Vice President of Product Management. "In the past, lower voltage meant lower performance, but now with our extreme-low voltage optimized memory, consumers don't have to sacrifice high performance to also achieve energy savings."
OCZ's Platinum ELV line sips just 1.35 volts and come in 4GB and 6GB kits, while the company's new Reaper HPC and Gold ULV memory operate at 1.5 volts and are offered in up to 12GB capacity kits. Both the ELV and ULV kits are available in triple-channel and dual-channel form in DDR3-1600 and DDR3-1333 trim.
Those of you into the whole competitive overclocking scene may already be familiar with "Mat," or Matthias Zronek, whose most recent accomplishments include breaking not one, but two DDR3 frequency records.
He bested the previous records using Corsair Dominator GT GTX6 sticks, which he goosed to 3078.2MHz with latencies set to CL8-11-8-31, 1T and 3059.4MHz with slightly tighter timings of CL7-11-8-31, 1T.
"I've worked with the Corsair Dominator GT memory for quite some time now, and can easily say that these are great memory modules, dedicated to world-record overclocking," stated Matthias Zronek. What surprised me most is the potential of the Dominator GT GTX6. Even at 3000MHz and higher frequencies, at CL7, there is still headroom for lots of optimization."
Nice plug, but fair enough. As for the other core components, Mat used a Gigabyte P55A-UD7 motherboard and Intel Core i7 870 processor.
When you think of memory, Samsung probably isn't the first name to come to mind, but perhaps it should be. No other company produces more DRAM, and in the second quarter of 2010, Samsung further distanced itself from all competitors.
"Samsung's memory business long has pursued a strategy of taking the leadership in investment in new manufacturing processes, allowing it to be the first to move to advanced semiconductor process geometries, and thus enabling the company to make semiconductors at a lower cost and at greater efficiency than its competitors," said Mike Howard, senior analyst for DRAM technology at iSuppli. "The company's aggressive push into 40nm semiconductor lithography for DRAM manufacturing boosted the volume of its bit production dramatically. Meanwhile, Samsung's broad DRAM portfolio, including high-end devices like mobile and legacy parts, allowed it to achieve an ASP higher than the industry average."
Samsung cranked out 1.2 billion 1Gb density equivalent DRAM units in the second quarter, a 13 percent increase over its first quarter production and enough to pull in revenues of $3.8 billion.
While Samsung is flying high, Micron (Crucial's parent company) showed the weakest growth among the top-five DRAM suppliers in the second quarter. Micron's revenues rose by 4.1 percent to $1.43 billion, which iSuppli blames on manufacturing challenges at the company's Inotera facility.
The memory standards committee known as the JEDEC Solid State Technology Association announced the publication of JEDEC DDR3L, which the association says will enable a significant reduction in power consumption for a boatload of products that utilize memory, including laptops, desktops, servers, networking systems, and a a range of digital devices.
Those of you donning your detective caps might have guessed that the "L" in DDR3L stands for "Low Voltage," and you'd be right. Devices that adhere to the new standard will operate from a single 1.35V power supply voltage compared to 1.5V in existing devices, JEDEC said.
DDR3L-based memory devices will consume 15 percent less power compared to standard DDR3 (sometimes more), and a whopping 40 percent less than standard DDR2, all without taking a performance hit. The upshot here is longer battery life and cooling running devices.
G.Skill didn't just go and release an ordinary 48GB kit of RAM, if such a thing can ever be ordinary, but according to G.Skill, this is also the world's only hand-picked, hand-tested, ultra-high capacity DDR3 memory kit for workstations.
The kit consists of 12x4GB memory modules clocked at 1,900MHz, each one outfitted with the company's Ripjaws series heatsink. Obviously home users need not apply, and further limiting their utility, G.Skill says its new kit is intended exclusively for EVGA's Super Record 2 (SR-2) motherboard.
So what's the point? Bragging rights, for one. But as a workstation kit, 48GB can come in handy for 3D rendering, data modeling, scientific applications, and other specialized tasks.
No word yet on price or availability, but let's be real, we're just here to gawk, right?
Samsung on Monday claimed an industry first by announcing it has begun mass producing 2Gb (gigabit, not gigabyte) Green DDR3 using a 30nm manufacturing process.
"We’re seeing a sharp rise in demand for DDR3 chips and are meeting that need with the timely introduction of 30nm-class Green DDR3 solutions," said Soo-In Cho, president, Memory Division, Semiconductor Business, Samsung Electronics. "Thirty nano-class DDR3 DRAM will deliver the most satisfying user experience possible, offering extremely high performance and reduced power consumption for PC and server applications designed to capitalize on new multi-core processors."
According to Samsung, these environmentally sound memory modules are capable of reaching up to 1.866Gbps at 1.35V, while PC modules can ramp up to 2.133Gbps at 1.5V. That's 3.5 times faster than DDR2 and 1.6 times faster than 50nm DDR3, Samsung says.
So how does this translate into the real world? According to Samsung, 30nm-class 4GB DDR3 kits for PCs can operating up to 60 percent faster than two 50nm-class 2GB DDR3 solutions, all while using 65 percent less power.