It hasn't been much of an ARM wrestle in the tablet space up to this point, and it's not because AMD and Intel haven't talked the talk. For the most part, they just haven't walked the walk, which has allowed ARM to dominate the category. That could change once Windows 8 comes into view in a few months, and if Microsoft's upcoming Metro infused OS proves popular on touchscreen tablets, you can expect a dogfight between AMD and Intel.
When we think of Ivy Bridge, we conjure up images of decked out gaming rigs with high-end graphics cards and other burly hardware. And that's all well and good, but Intel's 3rd Generation Core processors are equally suited for IT and business end users, so it was inevitable that the Santa Clara chip maker would strengthen its vPro platforms with its latest and greatest processor technology.
Intel's 22nm processors, better known as Ivy Bridge, are fresh out of the fab and have given the Santa Clara's Core architecture a kick in the pants. But is the successor to Sandy Bridge and Sandy Bridge-E already old news? Not exactly, though a peek at Intel's Research & Development roadmap reveals that a 14nm manufacturing process is already in development, and that's just the tip of the iceberg.
After a ton of speculation, a bit of denial, and a ton of testing we finally have our answer. The thermal interface material change made by Intel when it went from Sandy Bridge to Ivy Bridge is indeed the cause of the excessive temperatures we’ve observed while overclocking. The first accusation was made in late-April by Overclockers.com, however proving it wasn’t easy. The Japanese division of PC Watch somehow managed to remove the integrated heat spreader from a Core i7 3770k, along with the stock binding and grease. They then proceed to replace it with aftermarket alternatives, and the results speak for themselves.
Advanced Micro Devices (AMD) managed to beat Intel's Ivy Bridge to the launch-day punch on a technicality when the Santa Clara chip maker began shipping Trinity and Brazos 2.0 APUs to OEMs last quarter, but as far as retail availability goes, AMD in April would only say the new parts "will be available globally soon." It appears "soon" really meant "next month," at least for notebook parts, and August for desktop chips.
Well, well, well, the latest version of the International Data Corporation (IDC) Worldwide Semiconductor Applications Forecaster (SAF) is something that PC doomsayers can shove right in their ill-informed pie holes. According to IDC, the worldwide semiconductor market grew by 3.7 percent in 2011 to $301 billion, and barring any unforeseen events, IDC expects the market to grow another 6-7 percent in 2012 with Intel leading the way. That's hardly the sign of a shrinking market, though mobile is playing a big role as well.
Intel stepped up to the plate and seemingly hit a homerun with its Ivy Bridge architecture (which, by the way, is now showing up in retail). It's the first commercial processor to boast a 22nm manufacturing process and 3D transistors, a combination that ultimately leads to better performance with less power consumption than previous generation processors. At the same time, some have reported higher temps with Ivy Bridge compared to Sandy Bridge, and it could have to do with the way Intel attached the Integrated Heat Spreader (IHS).
Ivy Bridge officially launched on Monday, though if you were holding off to build a system you might have noticed “launched” didn’t actually mean you could buy it. We were starting to wonder what the hold up was, than lo and behold we finally got word stock has started pouring into the retail channels.
Throughout the years, AMD's strategy against Intel has been to undercut the Santa Clara chip maker in price, though that's not necessarily by design. Clock for clock, AMD's processors don't usually pack the same performance punch as Intel's silicon, and that's especially true with the launch of Intel's Ivy Bridge architecture. In response to Ivy Bridge, AMD decided another round of price cuts was in order.
Samsung today officially introduced what it claims is the world's first quad-core application processor built on the High-k Metal Gate (HKMG) low-power process technology. It's called the Exynos 4 Quad, a 32nm 1.4GHz quad-core processor based on the ARM Cortex A9 architecture. With twice as many cores as its predecessor, the 45nm Exynos 4 Dual, Samsung claims the Exynos 4 Quad doubles the processing potential with a 20 percent lower power footprint.