We're just now starting to get used to seeing 6GB and 12GB of total memory in desktop systems, but such capacities are suddenly quaint compared to the latest 32GB modules Samsung's cooked up, even if not headed for the desktop.
According to Samsung, it's the world's first 32GB DDR3 RAM stick, and it was built using a 50nm process. A total of 72Gb (gigabit) DDR3 chip dies arranged in a row of nine quad-die packaged 16Gb DDR3s are packed on each side of the module, resulting in 32GB of total memory. And in addition to boasting higher capacity, Samsung says its 32GB RDIMM also improves throughput by 20 percent and consumes less power at 1.35V compared to previous sticks running 1.5V.
No word yet on price or availability, or when Samsung plans to launch its 8GB modules designed for the desktop.
One of the concerns in the transition to Core i7-based platforms was how Intel's new chips would fare with DDR3 memory exceeding 1.65V. Early reports warned that the higher voltage kits might potentially pose a risk to the processor, prompting memory makers to focus on triple-channel kits with lower voltage than their dual-channel counterparts. But voltage restrictions could become even less of a concern now that Elpida has completed its development of a 50nm process DDR3 SDRAM.
Elpida claims its new DRAM features the lowest power consumption in the industry, requiring as little as 1.2V, making them good candidates for eco-conscious server environments and data centers. The 2.5Gbps-capable chips can also operate at 1.5V and Elpida says initial applications will include high-end desktops.
Mass production of the 50nm chips is scheduled to being in Q1 2009.