Toshiba and its manufacturing partner SanDisk officially cut the ribbon on their third 300mm wafer NAND fabrication facility at Toshiba's Yokkaichi Operations in Mie Prefecture, Japan. They're calling it Fab 5, which has nothing to do with the 1991 University of Michigan men's basketball team, though its foundation is just as solid.
The structure is made of 2-story steel frame concrete and spans five floors. Toshiba and SanDisk say Fab 5 incorporates advanced earthquake-absorbing structures and integrates multiple power compensation techniques for protection against unexpected disruptions. It also boasts LED lighting and powering-saving manufacturing equipment to meet Toshiba's goal of 12 percent less CO2 emissions than Fab 4.
On the manufacturing side, Fab 5 will immediately start volume production using 24nm process technology, and its first wafers will come off the assembly line in August. Later on, Fab 5 will transition to 19nm manufacturing.