Samsung late last night put the word out that it's started producing embedded multi-chip package (eMCP) memory for use in entry-level and mid-range smartphones. The new eMCP solutions are offered to manufacturers in a wide range of densities and utilize LPDDR2 (low power double-data-rate 2) DRAM made with 30nm class process technology and NAND flash memory using 20nm class technology, Samsung said.
"As the need is growing for more advanced software and increased data storage in smartphones and tablets, mobile device makers are expected to introduce embedded memory solutions throughout 2012 that offer higher performance and density," said Myungho Kim, vice president of memory marketing, Device Solutions, Samsung Electronics. "Samsung will further accelerate growth in the mobile device market as it extends the advanced memory segment by providing a more expansive line-up of eMCP solutions in 2012."
Samsung claims its new eMCP memory solutions will lead to better performance and longer battery life, as well as make things easier for mobile handset makers in the design process. The eMCP solutions are fabricated in packages that include 4GB e-MMC (Embedded MultiMediaCard) based on 20nm class NAND flash memory, and a choice of 256MB, 512MB, or 768MB of 30nm class LPDDR2 DRAM.