A handful of technological quandaries are keeping our small, yet powerful gadgets from becoming even smaller and powerful; one of those issues -- as any iPad or Asus Transformer Prime owner can tell you -- is heat dissipation. The copper technology found in most modern day doo-dads just ain't cutting it anymore. Fortunately, an NC State researcher has devised a new way to cool down hot electronics 25 percent faster than existing technology -- and at a lower price, to boot.
PC gaming lovers will understand the basics of the new cooling tech: it's basically a glorified heatsink. The heat spreader developed by materials science engineer Dr. Jag Kasichainula is made from a copper-graphene composite and attaches to <insert electronic device here> using an indium-graphene film. The combined forces of the heat spreader and film have a thermal conductivity that's 25 percent more efficient than copper alone, and thanks to the relative lack of that oh-so-expensive copper, creating the graphene-saturated tech costs less than traditional copper-based cooling methods.
It's fairly slim, too, with just 200 micrometers worth of material needed. Some quick Google Fu shows that to be 0.2 millimeters thick.