It's that time of year again, when CES looms just around the corner and company's giddy with anticipation begin teasing with sneak peeks of what's to come. Enter Kingston, the memory maker who over the weekend released a few photos of its upcoming liquid-cooled memory modules.
To be released under the company's HyperX brand, the liquid-cooled DDR3 kit comes with barbs for connecting to existing water cooling loops. And while these modules will obviously be aimed at overclockers, Kingston didn't say what frequency the upcoming chips will ship at, or any other specs, such as voltage or latencies.
According to Bit-tech, the modules are currently undergoing testing in Kingston's labs before the company makes a formal announcement during CES next month.