The USB 3.0 SuperSpeed spec really is all that and a bag of Baked Lays (unless you're not a fan of Baked Lays, in which case insert your own awesome variety of chips). For starters, USB 3.0 crushes USB 2.0 in maximum theoretical transfer rates at up to 4.8Gb/s versus 480Mb/s. But speed isn't the only benefit. The SuperSpeed spec supports full-duplex data transfers, delivers more power to devices, and allows for longer cable runs. And best off, it's backwards compatible with USB 2.0.
So why the frak aren't we seeing USB 3.0 all over the place? Blame it on Intel, the world's No. 1 chip maker who happens to be dragging its feet in supporting the new spec. The only way you'll find USB 3.0 on boards now is through a third-party chip, primarily from NEC.
That's about to change. According to a Chinese-language Commercial Times report, Intel is expected to announce its own USB 3.0 host controller for its Couger Point motherboard reference design at the upcoming Intel Developer Forum (IDF).
Once Intel makes the announcement, you can expect USB 3.0 devices to start barreling through the market. We've already seen a handful of SuperSpeed products pushed through the mainstream pipeline, but by this time next year, the USB 3.0 landscape should look decidedly different.