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AMD says just as we have gone beyond the single-core era, we are rapidly coming to the end of the multi-core era and are now entering the new Heterogeneous Systems Era which will feature parallelism and power efficient GPUs.
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What a surprise, AMD says as we move from proprietary APIs *cough* CUDA to OpenCL, DirectCompute and onto Heterogeneous System Architecture, programming will become far easier and mainstream. Much of that will come from the APU appearing as one processor to a programmer.
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AMD’s first step in HSA was the integration with Brazos and Llano. This year, AMD will see C++ support and over the next two years HSA will continue to fuse into one processor.
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Perhaps one of the most interesting features of HSA will be the ability to plumb third party intellectual property into a chip. What can this be used to accelerate? Just about anything its customers wants, the company said.
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AMD says one of the challenges today is communicating between the CPU and GPU. That will be solved by first sharing memory and eventually sharing memory registers between the GPU and CPU.
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In one of the niftier demos AMD ran, a short CG-like movie short was shown to the audience. AMD then stopped the demo and showed that it was rendered in real-time on a Radeon HD 7970 card.
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Besides an updated Brazos chip and Trinity, AMD has high hopes for its Hondo ultra low power chip. AMD says the first iteration will consume 4.5 watts with future version dropping that to 2.5 watts.
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Next year will see a completely new GPU architecture called Sea Islands as well as the company’s APU’s moving over to a 28nm process.
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Enthusiasts were given a scare last year when AMD implied that performance desktops didn’t matter anymore. This slide shows that while it may be true that APUs are in the driver’s seat, the company still has plans to support enthusiasts. This year we’ll see the 32nm-based Vishera CPU that will feature from 4 to 8 Piledriver cores.
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Once we move into 2013, all of the APUs will transition over to 28nm parts. Where will those 28nm parts be built? That’s not quite clear yet but many speculate TSMC will get the contract.
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AMD will introduce a BGA version of its upcoming Trinity APU to help build thinner “Ultrathin” notebooks. Ball Grid Array chips must be soldered to the motherboards of notebook computers making them thinner than more flexible and traditional socketed processors.
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Despite problems getting the chips produced last year, AMD said it shipped a healthy 10 million Llano APU’s in 2011. Trinity, pictured here, will replace Llano and offer 25 percent more x86 performance and 50 percent more graphics performance.
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A traditional socketed processor allows OEMs to switch processors easily but add thickness to a notebook.
