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Analyst Says Intel-based Thin Laptops Plagued with Design Flaws
Created 07/03/2009 - 6:12am

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Analyst Says Intel-based Thin Laptops Plagued with Design Flaws

Posted 07/03/09 at 09:12:10 AM  by Pulkit Chandna

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Doug Freedman, an analyst for Broadpoint AmTech, has revealed to Cnet that early production units of ultra-thin laptops, which are being made out of plastic, are fissuring due to design flaws. He gleaned this information from his discussions with original equipment manufacturers (OEMs) and original design manufacturers (ODMs).

Freedman believes manufacturers will have to ultimately “go with a metal case” to achieve that ultra-thin form factor they are after. However, the use of metal cases will make ultra-thin notebooks costlier.

A reference to Intel’s CULV (Consumer Ultra Low Voltage) technology – meant for ultra-thin notebooks - in Freedman’s report elucidating the design issues prompted Intel to clarify that the “case design issues reported to be found by an ODM, not consumers, in early production units for ultra-thin laptops have nothing to do with Intel processors whatsoever.”

Freedman had said that some manufacturers are more interested in manufacturing 11-inch and 12-inch netbooks with the Atom processor rather than ultra-thin notebooks with Intel’s CULV technology.

COMMENTS:1
TAGS: intel, design, hardware, OEM, report, ultra-thin, CULV, odm, plastic case
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Source URL: http://www.maximumpc.com/article/%5Bprimary-term%5D/analyst_says_intelbased_thin_laptops_plagued_design_flaws

Links:
[1] http://www.maximumpc.com/user/opulent_rigs_0
[2] http://news.cnet.com/8301-13924_3-10276904-64.html?part=rss&subj=news&tag=2547-1_3-0-20
[3] http://www.maximumpc.com/article/news/intel_plans_launch_two_new_cpus_ultrathin_notebooks
[4] http://www.maximumpc.com/article/news/hp_recycle_existing_form_factors_its_first_culvbased_notebooks
[5] http://www.maximumpc.com/article/news/intel_intros_new_pentium_su2700_culv_chip_gs40_chipset