By now everyone is familiar with the problems Nvidia has had with its notebook GPUs, which resulted in an " abnormal failure rate " for what remains an unspecified number of graphics chips. But throughout all the speculation, including accusations that whatever problem has been plaguing the chip maker might also be affecting desktop units as well, Nvidia has avoided speaking out on the issue at any length. Until now, thanks to some prodding by AMD.
Earlier this week AMD's Packaging and Interconnect Director, Neil McLellan, went on the semi-offensive and said Nvidia not only uses inferior materials for its chip package design, but that the company just doesn't care as much about packaging technologies as AMD does, according to The Tech Report. Ouch. Those comments didn't sit well with Nvidia, who fired back in a letter in defense of its position.
"In his recent commentary on chip packaging, Mr. McLellan makes a number of speculative assertions about NVIDIA's people, products and philosophy," Nvidia wrote . "In his interview McLellan asserts that High lead bumps are more prone to fatigue. What he fails to note is that AMD currently uses High lead bumps on their CPU line -- a device well known to undergo high thermal stress, and also go through lots of power cycling."
Nvidia went on to talk about High Lead bumps being used in "10s of billions of semiconductor devices" and a whole lot more, but stopped short of saying what exactly caused earlier problems with its 8M series.
Anyone up for a round 2 of AMD versus Nvidia?
Image Credit: Nvidia