Sparkle Proposes Better Heat Dissipation with Diamond Technology
Sparkle Proposes Better Heat Dissipation with Diamond Technology
Posted 02/16/2009 at 2:30pm
| by Paul Lilly
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Diamonds might be a girl's best friend, but Sparkle's Diamonds Sputtering technology looks to cozy up to videocards in an attempt to offer better heat dissipation.
The company today announced the new technology, which it says consists of outfitting the cooling fins on videocards with a Diamond-like Carbon (DLC) membrane. According to Sparkle and its R&D team, DLC offers high heat conduction capable of dissipating heat much more effectively than copper alone.
"The diamonds do heat dissipation four times faster than copper, it relies on the phonons which is produced by the crystal lattice vibration, to bring heat to lower temperature places," Sparkle wrote in its press release. "Diamond-like Carbon can achieve both functions at the same time, that is, transferring heat to lower temperature places with both graphite metal bond and diamond insulation bond (the covalent bond)."
It gets even more technical and goes on to discuss the process of Plasma Enhanced CVD (PECVD) to plate the DLC membrane on videocards, but the end result is a 5C temperature reduction on a 9500GT, according to Sparkle. But don't hold your breath for diamond-cooled videocards any time soon. Sparkle admits the technology carries a "high" cost and is still mulling over bringing DLC to market.
Image Credit: Sparkle
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hillc89
June 25, 2009 at 9:56pm
Hello,
In the ever-changing world of Information Technology (IT), creating
effective IT solutions is key to organizational success. For over a
decade, Diamond Technologies has been taking the uncertainty...
gemfind
March 19, 2009 at 12:38am
According to the manufacturer, video-card companies need to find new ways of solving heat dissipation, and its own R&D team has been hard at work developing a diamond-like carbon (DLC) membrane that can be used on the surface of a video card's cooling fins to add a number of benefits. http://www.gemfind.com/
rayatwork05
February 17, 2009 at 4:58am
it wouldnt be totally crazy to start a new form factor focused towards cooling....granted the current setup does have cooling in mind.....one where all the components on motherboard like flat and parallel, instead of perpindicular, would allow far more methods of removing an excess amount of heat, rather then a small portion. + the allowable surface contact to reduce more heat.
Keith E. Whisman
February 16, 2009 at 3:59pm
Soon you will be able to purchase your HSF's at pawn shops.
I'll take that 4Karat GPU HSF please and that 17Karat CPU HSF.
Just imagine my boys will be able to propose for marrage with a HSF just right for their girlfriends.
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