Minds at the University of Wisconsin-Madison have created a method to calculate how different degrees of strain affect electronic structures in silicon. Sound confusing? Well, truthfully it is, but it could soon bring you new CPUs that produce much less heat and use less power.

Today’s strained silicon is very limited. This is mostly caused by the techniques that are in place to create it, and the physics of strain (which still haven’t been fully mapped out). But, thanks to a team of dedicated researchers led by Max Lagally, the Professor of Materials Science and Engineering at UW-M, this is all about to change.

The creation process, which previously didn’t always provide a uniform stretch of the silicon across the surface of the chip, has been drastically changed thanks to the research of Legally’s team. Having mapped out the effects of strain on electric structures in silicon, they finally understand why there are drastic increases and decreases in electron mobility from sheet to sheet. This will allow them a more uniform creation process that will produce more predictable results.

To produce their samples they stretched out films of silicon for research. “Imagine [attaching] a ring and a hook to all four corners [of a piece of thin film silicon] and pulling equally on all four corners like a trampoline,” said Legally, “it stretches out like that.”

Should this research come full circle, there’s no doubt that we’ll all reap the rewards.

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cpu, hardware, silicon, Strained Silicon

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