Samsung Introduces 0.6mm-Thick Flash Chips for Mobile Devices
Samsung Introduces 0.6mm-Thick Flash Chips for Mobile Devices
Posted 11/06/2009 at 4:23pm
| by Pulkit Chandna
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Samsung has announced a new breakthrough that could lead to mobile devices with greater storage space than before. The company says it has developed a new multi-chip memory package that is 40% thinner and lighter than a normal memory package. The 0.6mm-thick package is said to contain eight 30-nanometer NAND Flash chips.
The new package owes its lean figure to a “bare” die that is just half as thick as a conventional die. The ultra-thin package contains a “bare” die that is only 15 micrometers thick. This is quite an achievement on Samsung’s part as it has managed to overcome “the conventional technology limits of a chip's resistance to external pressure when under 30um in height.” Chips based on this new technology seem tailor-made for SSDs and mobile devices.
Image Credit: Samsung
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