Samsung has announced a new breakthrough that could lead to  mobile devices with greater storage space than before. The company says it has developed a new multi-chip memory package that is 40% thinner and lighter than a normal memory package. The 0.6mm-thick package is said to contain eight 30-nanometer NAND Flash chips.

The new package owes its lean figure to a “bare” die that is just half as thick as a conventional die. The ultra-thin package contains a “bare” die that is only 15 micrometers thick. This is quite an achievement on Samsung’s part as it has managed to overcome “the conventional technology limits of a chip's resistance to external pressure when under 30um in height.” Chips based on this new technology seem tailor-made for SSDs and mobile devices.

Image Credit: Samsung