Novel Develops World's Thinnest Air Cooled Heatsink



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What about dust?


The more air your moving, the most dust your moving, right?






The 25X VOLUMETRIC cooling efficiency is achieved by rotating (via motor) a thin toroid (circular disc), which generates an axial to radial fluid flow field (see animation on website), and having the heat sink parallel and within the radial portion of the flow field.   The local radial velocity near the 40mm diameter rotating toroid's perimeter, at 6,000 rpm is ~12.6 m/s.  This high velocity radial flow field enjoys further air volume (for addition cooling) due to entraining remote air (Bernoulli Effect).  The volumetric cooling efficiency of today’s leading overclocking heat sinks are ~0.0032 W/°C/cc, compared to 0.081 W/°C/cc for the credit card sized ThinSink.


ThinSink was developed for small low profile cooling envelopes.


I hope this helps.



a review unit costs $750??? 0_o...



I dont understand how this actually works....



This smacks of hyperbole to me... Even if it is 100% true, the fan spinning at 6,000 RPM being "quiet" is suspect at best. Hard drives aren't quiet while sealed inside their individual cases, and they typically spin at 5400, 7200, and 10,000 RPM. Worse still is that under such speed and strain they can (and do) break down. This isn't even touching on the fact that a fan will make some noise proportional to the turbulence in the air as a result of it creating localized pressure differential in order to move air. While muffled at low RPM to the point of being inaudible, the harder and faster you try to move air, the more noise it makes. Not just the fan's motor and moving parts clattering mind you, the actual moving air itself does indeed make noise and contribute to the overall noise.


What happens when such a design breaks, and has to rely completely on passive cooling? A melted component is what happens.


Large radiator and tower coolers are the preferred method of cooling for components, such as CPU's, GPU's, and so on that are to be cooled by air, or even passively, because they vastly extend the amount of surface exposure the heat can make to the ambient temperature, and thus exchange and extract that heat from the source to the surrounding environment.


Solutions like this one may one day prove themselves against more tried, true, and practical alternatives, but this one tells me from quite a distance off, that it is a critical point of failure waiting to happen.



Dude, I want one for my i7.  If it's so much better than existing coolers, why not throw one in?  Why not send max PC a demo to review if it truly lives up to it's expectations?



Its not made for that type of processor. It is made for micro processors like the atom in netbooks. Put this on a full sized proc and it will cook worse than the stock HSF assembly. They were saying it outperforms Microprocessing coolers not full sixed ones.

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