Intel's New U.S. Fab to Specialize in 450mm Wafers
Intel's New U.S. Fab to Specialize in 450mm Wafers
Posted 12/10/2010 at 9:23am
| by Paul Lilly
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According to an EETimes.com report, Intel put to rest all the recent speculation surrounding its new U.S. fab and confirmed it's being constructed to handle 450mm wafers.
As part of a $6 billion to $8 billion investment, Intel is upgrading several U.S. facilities for 22nm production, as well as building the aforementioned fab in Hillsboro, Oregon. This will be known as D1X and it will go live in 2013.
"Intel is very interested in 450mm," said Mark Borh, Intel Senior Fellow and director of process architecture and integration at Intel. "D1X is being (constructed) to be compatible with 450mm."
The upshot to increasing wafer size like this is that Intel can squeeze more chips out of a single wafer and potentially reduce manufacturing costs.
300mm wafer shown
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brentrad
December 10, 2010 at 12:46pm
Nope, Intel has 2 fabs in Arizona, 2 in Hillsboro, Oregon, and several more in the US. In fact, I drive by the Hillsboro fab every day on my way to work. Very excited about the new Hillsboro fab, Oregon can definitely use the jobs, we have one of the worst unemployment rates in the US currently. The Portland Oregon area was known as "The Silicon Forest" because of all the high-tech manufacturing - there's still a lot here, but a lot of it has been outsourced to other countries. I got my start at my first real jobs after high school doing electronics assembly in this area.
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