Intel on Track for 300mm Fab in China
PrintThings are all going to plan, said Intel, who is scheduled to begin operations at its 300mm fab in Dalian, China, in 2010. Manning the fabrication plant will be the first batch of graduates from the Semiconductor Technology Institute.
According to Intel, manufacturing with 300mm wafers has a dramatic effect on the company's ability to produce semiconductors at a lower cost. In addition, 300mm manufacturing consumes 40 percent less energy and water per chip than a 200mm wafer factory, the company said.
The site in question was first announced in 2007 as a $2.5 billion project in what would ultimately become the company's first wafer fab in Asia. It was the first time since 1992 with the construction of Fab 10 in Ireland that Intel had built a fab from the ground up.
Image Credit: Intel
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k11k
June 09, 2009 at 9:40am
Can't wait till China ripe off Intel. China will have it own Intel ripoff chip sooner than later it seems. They get you by selling cheap labor, than they sell your product cheaper.
the_river
June 09, 2009 at 8:11am
One word came to mind: Outsourcing. I don't care that they came up with a better way to manufacture much that they decided that it would cost them also less to pay Chinese workers to do what American workers should be doing.
Good idea Intel! Cut those American jobs! You'll save more on top of your new Fab process.
Tekzel
June 09, 2009 at 7:01am
Something I have always wondered, but never bothered to ask... Why do they make those wafers round? There appears to be a lot of waste around the edge and dies are square, so if they made them square wouldn't they get a little more out of each wafer? There has to be a logical answer, but I haven't really looked into it. Maybe I should google it.
Edit: Posting this made me actually bother to go look it up, and it makes sense now.
nekollx
June 09, 2009 at 8:35am
Well don't make us google it and wase carbons, :P
Tell us.
What i dont get is why 300MM is better then 200mm (thats what the article seems to say)
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