VIA Designs "World's First" Mobile ITX Module
VIA Designs "World's First" Mobile ITX Module
Posted 01/21/2010 at 10:30am
| by Paul Lilly
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VIA this week unveiled what it claims is the first product based on the recently announced Mobile-ITX form factor, the EPIA-T700. It measures just 6cm x 6cm and is intended primarily for medical, military, and in-vehicle applications.
"The VIA EPIA-T700 takes advantage of the modular design principles inherent in our Mobile-ITX form factor specification, making it easier than ever before to create astonishingly compact x86 devices that don't compromise on features," said Daniel Wu, Vice President, VIA Embedded Platform Division, VIA.
VIA says its module can be used with a variety of carrier boards and is fully customizable. At the heart of the EPIA-T700 is a miniaturized 1GHz VIA Eden ULV processor and 512MB of DDR2 on-board memory.
Image Credit: VIA
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