Cooler Master Shows Off New "Vertical Vapor Chamber" Heatsink Technology
Plan on buying a Cooler Master heatsink sometime soon? If so, you could be buying into a new cooling design the company’s dubbed “Vertical Vapor Chamber Technology.” Cooler Master claims that by tinkering with the traditional heatsink design, Vertical Vapor Chambers run cooler and quieter than traditional cooling solutions.

So how, exactly, does “Vertical Vapor Chamber Technology” work? Cooler Master details the technology in its press release:
Vertical Vapor Chambers feature less than half the air resistance by reducing airflow vortexes and noise generated by air streaming through a heatsink. At the same time vertical vapor chambers exhibit 3 times the fin contact area, enabling faster and more efficient transfer of heat from the vapor chambers to the fins, and overall more efficient use of the available fin surface area.
No word yet on pricing details, but TechPowerUp reports that the first heatsinks packing the new design are scheduled to hit the streets soon after the CeBIT trade show in March.
Comments
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Kromix
January 17, 2012 at 11:30am
what about the computers with the motherboard in vertical position?
which accounts for most?
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Eoraptor
January 17, 2012 at 9:03pm
Vapor cooling is nothing new... this is basically just a refinement of standard heat-pipe cooling technology that we've seen for a decade or so on the CPU, transitioning from cylindrical bent pipes to flat fluid channels with much higher surface area-to-fluid ratios. Really it's kind of a "duh" move that was only waiting on the metallurgy to catch up and allow non-cylindrical channels to exhibit the same structural rigidity as their round counterparts.
Yes, it would be MOST efficient in a vertical arrangement, but in any closed system vapor boils off of the CPU's heated contact area, and then moves away to any cooler area (those being cooled by the heat radiating of the fins) and then condenses and flows back to the CPU area to replace the material being evaporated off. It's basic thermodynamics and fluid movement, the same way that air and water currents move around the Earth from hot to cold.
(And YAY! maxPC finally fixed the posting box so that firefox spell check works!)
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Danthrax66
January 17, 2012 at 5:38pm
The heat will still transfer to the "cold" metal regardless of position since metal conducts heat better than air. Graphics cards have been using vapor chambers for a while glad to see it finally being used in CPU cooling.
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