Exclusive: We Build the First Nehalem System. Don't Tell Intel!
It’s the worst kept secret in the industry: Intel’s next-generation Penryn killer, codenamed Nehalem is just around the corner. We’ve been seeing leaked benchmarks based on early silicon for months, and Nehalem’s Wikipedia page is already packed with unconfirmed specifications. All indications – and this is with more optimizations to come, mind you – is that Nehalem may be a bad mother worthy of having Isaac Hayes pound out a theme song for it.
A Bloomfield chip compared to a Core 2 Quad 6700
OK, we get it. It’s going to be fast, but just how difficult is it to build a Nehalem rig? What are the catches? Will the new motherboard and socket require some silly new BTX form factor?
To find out, we convinced one of our hardware contacts (who’ll remain unnamed) to let us into its lab so we could finally get our hands on the new chip. There, we were provided with the desktop version of Nehalem – called Bloomfield – and an Intel D58XSO “Smackover” board.
This particular sample was the 2.93GHz Bloomfield, which will put it in the mid-range of the three desktop Bloomfield chips expected to be due by the end of this year. One thing we immediately noticed when holding a Bloomfield next to a Core 2 Quad is how much larger the actual chip is. The new LGA1366 socket is also a bit larger, of course. As such, previous LGA775 heatsinks will not be compatible with the new CPU. Some coolers may possibly be adapted to work with Bloomfield with new mounting brackets but most will need new heat sinks.


The larger socket and “keep out zone” also means motherboard configurations will be different as well. On the Smackover board, for example, Intel chose to move the north bridge from the usual spot just under the CPU about three inches to the right. This shouldn’t be a problem since the memory controller now gets relocated from the chipset to the CPU, so there are far fewer wires to run from the north bridge.

The X58 motherboard (on the left) next to a LGA 775 mobo. Note that the socket orientation is rotated on the new board.

RAM configurations with Bloomfield will certainly confuse system builders who’ve been trained to think in terms of dual-channel memory pairings. Bloomfield’s onboard DDR3 controller supports three individual DDR3 channels. To get all three channels up and running you need three separate DIMMs. Board vendors will likely take two different routes.